Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

SDI接口数字监视设备的设计与实现

介绍了一种对SDV(串行数字视频)信号进行解码的设备设计方案，提出了该系统的总体构架，并对该系统的硬件设计、软件设计进行了全面的论述。设计的产品具有较高的性能价格比，已进入了推广阶段。     

Restricted overlapping balancing domain decomposition methods and restricted coarse problems for the Helmholtz problem

Overlapping balancing domain decomposition methods and their combination with restricted additive Schwarz methods are proposed for the Helmholtz equation. These new methods also extend previous work on non-overlapping balancing domain decomposition methods toward simplifying their coarse problems and local solvers. They also extend restricted Schwarz methods, originally designed to overlapping domain decomposition and Dirichlet local solvers, to the case of non-overlapping domain decomposition and/or Neumann and Sommerfeld local solvers. Finally, we introduce coarse spaces based on partitions of unity and planes waves, and show how oblique projection coarse problems can be designed from restricted additive Schwarz methods. Numerical tests are presented.     

WINDOWS系统中高效串行通信的实现

介绍了windows环境下串行通信的核心，并以VC 为开发工具给出了I／O函数与API通信函数实现串行通信的具体编程步骤。     

Wood inspection with non-supervised clustering

Abstract. The appearance of sawn timber has huge natural variations that the human inspector easily compensates for mentally when determining the types of defects and the grade of each board. However, for automatic wood inspection systems these variations are a major source for complication. This makes it difficult to use textbook methodologies for visual inspection. These methodologies generally aim at systems that are trained in a supervised manner with samples of defects and good material, but selecting and labeling the samples is an error-prone process that limits the accuracy that can be achieved. We present a non-supervised clustering-based approach for detecting and recognizing defects in lumber boards. A key idea is to employ a self-organizing map (SOM) for discriminating between sound wood and defects. Human involvement needed for training is minimal. The approach has been tested with color images of lumber boards, and the achieved false detection and error escape rates are low. The approach also provides a self-intuitive visual user interface. Received: 16 December 2000 / Accepted: 8 December 2001 Correspondence to: O. Silvén     

基于互信息域的L2S接口方法研究

分析了基于互信息域的有效信噪比映射的L2S(link level to system level)接口方法,研究了信道相关带宽对接口复杂度的影响,在不明显降低预测准确度的前提下,验证了利用信道相关带宽来简化接口计算复杂度的可能性。     

An anti-plane crack perpendicular to the weak/micro-discontinuous interface in a bi-FGM structure with exponential and linear non-homogeneities

Treated was an anti-plane crack perpendicular to the interface of an exponential-type FGM strip bonded to another linear-type FGM substrate with infinite thickness. Through Fourier integral transform, the problem was reduced as a Cauchy singular integral equation, which was further solved numerically by the Lobatto–Chebyshev collocation method. Based on the numerical solution, the effects of the geometrical and physical parameters on the stress intensity factor (SIF) were analyzed and the following conclusions were obtained: (a) A notable discrepancy between the interface-perpendicular crack and the interfacial one is that, to reduce the weak-discontinuity of interface or to make the interface micro-discontinuous will not necessarily decrease the SIF of the former, but will surely decrease that of the latter. (b) When a crack tip is situated very near to the interface (or free surface), its SIF will be high and totally dominated by the interface (or free surface). (c) To increase the stiffness of the FGM on one side of the interface is beneficial to preventing the crack on the other side from growing toward the interface. Besides, some practical suggestions were further given for material design in the field of composites.     

Modeling and performance analysis of IP access interface in optical transmission networks with packet switching

The article analyzes the influence of the Internet Protocol (IP) access interface on the packet loss probability and delay times in the optical packet switched network. The network and node model have been proposed, and the structure of the IP access interface, including assembler and holder, have been included in the analysis. It has been shown that the increase of the maximum optical packet sizes, as well as use of the holding feature as contention resolution mechanism, decrease the packet loss probability, but introduce delays at the optical network access points. Modeling and analysis were based on the discrete event simulation assuming self-similar traffic sources. IP packet lengths were modeled using empirical data. This work has been conducted while the author was affiliated with the Telecommunication Laboratory, Swiss Federal Institute of Technology (EPFL-STI-ITOP-TCOM), Lausanne, Switzerland     

码分多址（CDMA）技术和公用空中接口综述

本文主要讨论数字移动通信中扩频码分多址技术，阐明了ＣＤＭＡ体制的优越之外，分析了ＣＤＭＡ的关键技术，全面介绍了ＣＤＭＡ系统设计的基本原则和ＩＳ－９５－Ａ空中接口标准的含义。